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US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING, NATIONAL YANG MING CHIAO TUNG UNIVERSITY on July 14 for "Semiconductor device having source/drain contacts connecting 2-D material layer and method for forming the same" (Taiwanese, American Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,042, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan) and NATIONAL YANG MING CHIAO TUNG ... Read More


US Patent Issued to Applied Materials on July 14 for "Reactive-ion deposition processes for dielectric material formation" (California, Oregon Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,043, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Reactive-ion deposition processes for dielectric mat... Read More


US Patent Issued to KOKUSAI ELECTRIC on July 14 for "Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,044, issued on July 14, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo). "Method of manufacturing semiconductor device, method of processing... Read More


US Patent Issued to ASM IP Holding on July 14 for "Deposition of oxide thin films" (Finnish, American Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,045, issued on July 14, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Deposition of oxide thin films" was invented by Suvi P.... Read More


US Patent Issued to Applied Materials on July 14 for "Doped silicon oxide for bottom-up deposition" (California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,046, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Doped silicon oxide for bottom-up deposition" was in... Read More


US Patent Issued to Applied Materials on July 14 for "Atmospheric pressure plasma for substrate annealing" (California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,047, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Atmospheric pressure plasma for substrate annealing"... Read More


US Patent Issued to Tokyo Electron on July 14 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,048, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing method and substrate processing apparatus" was i... Read More


US Patent Issued to FUJI ELECTRIC on July 14 for "Semiconductor device and manufacturing method of semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,049, issued on July 14, was assigned to FUJI ELECTRIC Co. LTD. (Kanagawa, Japan). "Semiconductor device and manufacturing method of semicon... Read More


US Patent Issued to Applied Materials on July 14 for "Methods and apparatus for processing a substrate" (California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,050, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Methods and apparatus for processing a substrate" wa... Read More


US Patent Issued to Resonac on July 14 for "Etching gas, etching method, and method for producing semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,051, issued on July 14, was assigned to Resonac Corp. (Tokyo). "Etching gas, etching method, and method for producing semiconductor device"... Read More